COF Package / Film Design Engineer

1.负责COF封装新产品 PKG/Film 设计及客户需求确认；
2.根据客户需求定制 COF封装 PKG/Film 设计，并协同总部设计人员和工程专家确认设计可行性；
3.COF PKG 新产品开发阶段技术风险分析和管理，客户端使用Risk分析与解决方案树立；
4.COF PKG 产品路线，封装工程技术原理研究；

5.问题改善报告/开发各个阶段报告书撰写和汇报。 

Responsibility:   

1. In charge of COF Package/Film Design and customer request confirmation;

2. Customize COF PKG/Film design according to customer requirements, verifies design feasibility with headquarter designers and engineering experts.

3. Technical risk analysis and management at COF Design stage, customer field Risk analysis and solution establishment ;

4. COF PKG product roadmap set-up, packaging engineering research ;

5. Issue improvement report / development report writing and reporting.  

任职要求： 
1. 微电子/材料/物理/化学等专业本科及以上学历；  2. COF PKG 设计/Film 设计从业经验2年以上；
3. 熟练使用AutoCAD，Cadence APD等设计软件；
4. 了解COF PKG 封装过程中各个Process作业原理及主要Risk，有实际封装工程经验优先；
5. 具备良好英语(或 韩语)沟通能力和逻辑能力，良好的团队合作能力；
6. 能够适应较高强度工作压力以及必要的出差。

Requirement:  

1. Bachelor degree or above in Microelectronics / materials / physics / chemistry;

2. More than two years experience in COF PKG design and Film design ;

3. Skilled user of AutoCAD, Cadence APD and other related design software ;

4. Familiar with COF package assembly process, know the key risk of each process, (assembly process engineering experience is preferred) ;

5. Good English (or Korean) communication skills, Good teamwork ;

6. Able to work under pressure, Biz. travel is necessary if needed.